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 BT169D-L
Thyristor, logic level
Rev. 01 -- 12 November 2007 Product data sheet
1. Product profile
1.1 General description
Passivated sensitive gate thyristor in a SOT54 plastic package.
1.2 Features
I Designed to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits
1.3 Applications
I General purpose switching and phase control
1.4 Quick reference data
I VDRM 400 V I VRRM 400 V I ITSM 8 A I IT(RMS) 0.8 A I IT(AV) 0.5 A I IGT 50 A
2. Pinning information
Table 1. Pin 1 2 3 Pinning Description anode (A) gate (G) cathode (K)
A G
sym037
Simplified outline
Symbol
K
321
SOT54 (TO-92)
NXP Semiconductors
BT169D-L
Thyristor, logic level
3. Ordering information
Table 2. Ordering information Package Name BT169D-L TO-92 Description plastic single-ended leaded (through hole) package; 3 leads Version SOT54 Type number
4. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM VRRM IT(AV) IT(RMS) ITSM Parameter repetitive peak off-state voltage repetitive peak reverse voltage average on-state current RMS on-state current non-repetitive peak on-state current half sine wave; Tlead 83 C; see Figure 1 all conduction angles; see Figure 4 and 5 half sine wave; Tj = 25 C prior to surge; see Figure 2 and 3 t = 10 ms t = 8.3 ms I2t dIT/dt IGM VGM VRGM PGM PG(AV) Tstg Tj
[1]
Conditions
[1] [1]
Min -
Max 400 400 0.5 0.8
Unit V V A A
-
8 9 0.32 50 1 5 5 2 0.1 +150 125
A A A2s A/s A V V W W C C
I2t
for fusing
t = 10 ms ITM = 2 A; IG = 10 mA; dIG/dt = 100 mA/s
rate of rise of on-state current peak gate current peak gate voltage peak reverse gate voltage peak gate power average gate power storage temperature junction temperature
over any 20 ms period
-40 -
Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/s.
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
2 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
0.8 Ptot (W) 0.6 2.2 2.8 0.4 4 a= 1.57 1.9
001aab446
77 Tlead(max) (C) 89
101 conduction angle (degrees) 30 60 90 120 180 form factor a 4 2.8 2.2 1.9 1.57 0.5 IT(AV) (A) 113
0.2
0 0 0.1 0.2 0.3 0.4
125 0.6
Form factor a = IT(RMS) / IT(AV)
Fig 1. Total power dissipation as a function of average on-state current; maximum values
10 ITSM (A) 8
001aab499
6
4
IT ITSM
2
t tp Tj initial = 25 C max
0 1 10
102 number of cycles
103
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
3 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
103 ITSM (A) 102
IT
001aab497
ITSM
t tp Tj initial = 25 C max
10
1 10-5
10-4
10-3 tp (s)
10-2
tp 10 ms
Fig 3. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values
001aab449
2 IT(RMS) (A) 1.5
1 IT(RMS) (A) 0.8
001aab450
(1)
0.6 1 0.4
0.5 0.2
0 10-2
10-1
1 10 surge duration (s)
0 -50
0
50
100 150 Tlead (C)
f = 50 Hz; Tlead 83 C
(1) Tlead = 83 C
Fig 4. RMS on-state current as a function of surge duration for sinusoidal currents
Fig 5. RMS on-state current as a function of lead temperature; maximum values
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
4 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
5. Thermal characteristics
Table 4. Symbol Rth(j-lead) Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to lead thermal resistance from junction to ambient Conditions see Figure 6 Printed-circuit board mounted; lead length = 4 mm Min Typ 150 Max 60 Unit K/W K/W
102 Zth(j-lead) (K/W) 10
001aab451
1
P = tp T
10-1
tp T t
10-2 10-5
10-4
10-3
10-2
10-1
1 tp (s)
10
Fig 6. Transient thermal impedance from junction to lead as a function of pulse width
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
5 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
6. Characteristics
Table 5. Characteristics Tj = 25 C unless otherwise stated. Symbol IGT IL IH VT VGT Parameter gate trigger current latching current holding current on-state voltage gate trigger voltage Conditions VD = 12 V; IT = 10 mA; gate open circuit; see Figure 8 VD = 12 V; IGT = 0.5 mA; RGK = 1 k; see Figure 10 VD = 12 V; IGT = 0.5 mA; RGK = 1 k; see Figure 11 IT = 1.2 A IT = 10 mA; gate open circuit; see Figure 7 VD = 12 V VD = VDRM(max); Tj = 125 C ID off-state current VD = VDRM(max); Tj = 125 C; RGK = 1 k VDM = 0.67 x VDRM(max); Tj = 125 C; exponential waveform; see Figure 12 RGK = 1 k gate open circuit tgt tq gate-controlled turn-on time commutated turn-off time ITM = 2 A; VD = VDRM(max); IG = 10 mA; dIG/dt = 0.1 A/s VDM = 0.67 x VDRM(max); Tj = 125 C; ITM = 1.6 A; VR = 35 V; (dIT/dt)M = 30 A/s; dVD/dt = 2 V/s; RGK = 1 k 500 800 25 2 100 V/s V/s s s 0.2 0.5 0.3 0.05 0.8 0.1 V V mA Min Typ 2 2 1.25 Max 50 6 5 1.7 Unit A mA mA V Static characteristics
Dynamic characteristics dVD/dt rate of rise of off-state voltage
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
6 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
1.6 VGT(Tj) VGT(25 C) 1.2
001aab501
3 IGT(Tj) IGT(25 C) 2
001aab502
0.8
1
0.4 -50
0
50
100 Tj (C)
150
0 -50
0
50
100 Tj (C)
150
Fig 7. Normalized gate trigger voltage as a function of junction temperature
001aab454
Fig 8. Normalized gate trigger current as a function of junction temperature
3 IL(Tj) IL(25 C) 2
001aab503
5 IT (A) 4
3
2 1 1
(1) (2) (3)
0 0.4
1.2
2 VT (V)
2.8
0 -50
0
50
100 Tj (C)
150
Vo = 1.067 V Rs = 0.187 (1) Tj = 125 C; typical values (2) Tj = 125 C; maximum values (3) Tj = 25 C; maximum values
RGK = 1 k
Fig 9. On-state current as a function of on-state voltage
Fig 10. Normalized latching current as a function of junction temperature
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
7 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
3 IH(Tj) IH(25 C) 2
001aab504
104 dVD/dt (V/s)
(1)
001aab507
103
1
102
(2)
0 -50
10 0 50 100 Tj (C) 150 0 50 100 Tj (C) 150
RGK = 1 k
(1) RGK = 1 k (2) Gate open circuit
Fig 11. Normalized holding current as a function of junction temperature
Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values
7. Package information
Epoxy meets requirements of UL 94 V-0 at 3.175 mm
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
8 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
8. Package outline
Plastic single-ended leaded (through hole) package; 3 leads SOT54
c
E d A L b
1
D
2
e1 e
3
b1
L1
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 5.2 5.0 b 0.48 0.40 b1 0.66 0.55 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 e 2.54 e1 1.27 L 14.5 12.7 L1(1)
max.
2.5
Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 REFERENCES IEC JEDEC TO-92 JEITA SC-43A EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16
Fig 13. Package outline SOT54 (TO-92)
BT169D-L_1 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
9 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
9. Revision history
Table 6. Revision history Release date 20071112 Data sheet status Product data sheet Change notice Supersedes Document ID BT169D-L_1
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
10 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
10. Legal information
10.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
10.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
11. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
BT169D-L_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 12 November 2007
11 of 12
NXP Semiconductors
BT169D-L
Thyristor, logic level
12. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package information . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 November 2007 Document identifier: BT169D-L_1


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